Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Evonik Epoxy Curing Agent 2766

Evonik’s Epoxy Curing Agent VESTAMIN® 2766 is a high-performance aliphatic amine-based hardener offering rapid room-temperature cure, excellent chemical resistance, and superior adhesion to metals and composites—ideal for demanding industrial coatings, adhesives, and composite laminates requiring low viscosity and low odor.
  • evonik epoxy curing agent 2766_71f5c419
  • evonik epoxy curing agent 2766_71f5c419

Features Of Evonik Epoxy Curing Agent 2766

  1. High reactivity with standard epoxy resins, enabling reduced cure times at ambient or moderate elevated temperatures.

  2. Excellent chemical resistance post-cure, particularly against solvents, alkalis, and weak acids.

  3. Low viscosity and good compatibility, facilitating easy handling and homogeneous mixing without solvent addition.

  4. Low volatility and low skin sensitization potential, supporting safer industrial handling per current REACH guidelines.

  5. Enables high glass transition temperature (Tg) and superior mechanical strength in cured networks.

Typical Applications Of Evonik Epoxy Curing Agent 2766

  1. High-performance industrial coatings for metal substrates, including coil and can coatings.

  2. Electrical encapsulation and potting compounds requiring thermal stability and dielectric integrity.

  3. Structural adhesives in automotive and rail manufacturing where fast fixture and durability are critical.

  4. Composite matrix resins for wind turbine blade bonding and aerospace secondary structures.

  5. Repair mortars and high-strength grouts for civil engineering infrastructure.

Specifications Of Evonik Epoxy Curing Agent 2766

Chemical TypeAromatic amine adduct
Product FormLiquid
AppearancePale yellow to amber clear liquid
Viscosity (25 °C)300–600 mPa·s
Density (20 °C)1.08–1.12 g/cm³
Amine Value220–250 mg KOH/g
Reactivity ProfileMedium–high (faster than DETA, slower than m-PDA)
Primary ApplicationsCoatings, adhesives, composites, electrical encapsulation


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