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Highly efficient latent curing agent enabling extended pot life at room temperature.
Activates rapidly upon thermal stimulation (typically >100 °C), delivering fast gelation and full cure.
Excellent compatibility with standard DGEBA-type epoxy resins and low-viscosity formulations.
Halogen-free composition supporting modern regulatory requirements for electronics and industrial coatings.
Enables high glass transition temperature (Tg) and superior thermal stability in cured networks.
Electrically insulating encapsulants for power electronics and LED modules.
Potting compounds for automotive sensors and control units requiring reliable thermal cycling resistance.
Prepregs and laminates in high-performance printed circuit board (PCB) substrates.
Adhesives for structural bonding in aerospace and rail transportation components.
Coating systems for corrosion protection of metal substrates in demanding industrial environments.
| Chemical Type | Imidazole derivative (2-Ethyl-4-methylimidazole adduct) |
| Product Form | Off-white to light tan solid powder |
| Appearance | Free-flowing crystalline powder |
| Primary Applications | Latent curing agent for heat-curable epoxy systems |
| Key Features | Latency, thermal activation, halogen-free, low volatility |
| Benefits | Extended shelf life, precise process control, high Tg, RoHS-compliant |
| Storage Conditions | Store in original sealed container at 5–25 °C, protect from moisture |
| Handling Precautions | Use in well-ventilated areas; avoid inhalation of dust and skin contact |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
