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High reactivity with standard bisphenol-A and bisphenol-F epoxy resins.
Enables fast ambient-cure and low-energy thermal-cure profiles.
Delivers excellent chemical resistance and mechanical strength in cured networks.
Low viscosity for easy handling, metering, and homogeneous mixing.
Compatible with common epoxy formulation additives including fillers, pigments, and flexibilizers.
Structural adhesives for automotive and aerospace bonding.
Electrical encapsulation and potting compounds for power electronics.
High-performance coatings for industrial flooring and corrosion protection.
Composite matrix resins for wind blade and pultrusion applications.
Repair mortars and grouts requiring rapid strength development.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Viscosity (25 °C) | 300–600 mPa·s |
| Density (20 °C) | 0.94–0.98 g/cm³ |
| Amine Value | 220–250 mg KOH/g |
| Reactivity Profile | Fast ambient cure; full cure achievable at 25 °C in 24–48 h or at 60 °C in ≤4 h |
| Primary Applications | Adhesives, coatings, composites, encapsulants |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
