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High reactivity with standard bisphenol-A and bisphenol-F epoxy resins.
Enables fast ambient-cure or low-temperature cure profiles without sacrificing pot life.
Delivers excellent chemical resistance, particularly to alkalis and solvents.
Provides outstanding adhesion to metals, concrete, and composite substrates.
Low viscosity formulation ensures easy handling, metering, and mixing.
Industrial flooring systems for warehouses and manufacturing facilities.
Protective coatings for steel infrastructure and offshore assets.
Electrical encapsulation and potting compounds for power electronics.
Adhesives and structural bonding in automotive and rail components.
Composite matrix resins for wind turbine blade and aerospace tooling applications.
| Chemical Type | Amine-based aliphatic curing agent |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Primary Applications | Structural adhesives, protective coatings, composites, electrical encapsulation |
| Key Features | Fast cure, low viscosity, high reactivity, excellent adhesion |
| Benefits | Reduced processing time, improved productivity, enhanced durability |
| Storage Stability | At least 12 months at 20–25 °C in original sealed container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
