Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Evonik SUNMIDE 336 Polyamide Curing Agent

Evonik SUNMIDE 336 is a high-performance polyamide curing agent from Evonik’s SUNMIDE series, designed for epoxy resin systems requiring excellent flexibility, adhesion, and chemical resistance. It enables room-temperature curing with low viscosity, superior moisture tolerance, and extended pot life—ideal for industrial coatings, adhesives, and composites demanding robust mechanical properties and durability.
  • evonik sunmide 336 polyamide curing agent_0aa3481b
  • evonik sunmide 336 polyamide curing agent_0aa3481b

Features Of Evonik SUNMIDE 336 Polyamide Curing Agent

  1. Highly flexible aliphatic polyamide structure enabling excellent impact resistance and toughness in cured epoxy systems.

  2. Low viscosity and good compatibility with standard liquid epoxy resins, facilitating easy handling and homogeneous mixing.

  3. Room-temperature curing capability with balanced pot life (typically 4–6 hours at 23 °C) and rapid early strength development.

  4. Superior adhesion to diverse substrates including steel, concrete, aluminum, and composites—even under humid conditions.

  5. Low volatile organic compound (VOC) content and amine-free formulation, supporting safer industrial processing and regulatory compliance.

Typical Applications Of Evonik SUNMIDE 336 Polyamide Curing Agent

  1. Industrial floor coatings requiring chemical resistance, abrasion durability, and seamless application.

  2. Marine and offshore protective coatings for ballast tanks, decks, and submerged structures.

  3. Adhesives and structural bonding compounds in wind energy, automotive, and rail manufacturing.

  4. Repair mortars and grouts for civil infrastructure, including bridges, tunnels, and precast concrete elements.

  5. Electrical encapsulation and potting compounds where dielectric stability and thermal shock resistance are critical.

Specifications Of Evonik SUNMIDE 336 Polyamide Curing Agent

Chemical TypeAliphatic polyamide adduct
Product FormLiquid
AppearancePale yellow to amber transparent liquid
Viscosity (25 °C)1,200–1,800 mPa·s
Amine Value240–270 mg KOH/g
Density (20 °C)0.94–0.97 g/cm³
Flash Point (PMCC)≥120 °C
Storage Stability≥12 months in original sealed container at <25 °C


Evonik SUNMIDE 336 Polyamide Curing Agent – Frequently Asked Questions (FAQ)

Q1: What types of epoxy resins is SUNMIDE 336 compatible with?

A: SUNMIDE 336 is designed for use with standard liquid and solid bisphenol-A and bisphenol-F based epoxy resins, as well as many modified epoxy systems. Compatibility should be confirmed via small-scale formulation trials to assess reactivity, pot life, and final film properties.


Q2: How does SUNMIDE 336 compare to conventional polyamide curing agents in terms of handling and processing?

A: SUNMIDE 336 offers improved low-temperature reactivity and reduced viscosity compared to many traditional polyamide hardeners, enabling easier mixing and better flow in demanding applications such as high-solids or solvent-free coatings. It also exhibits lower volatility and favorable odor profile during handling.


Q3: What are the typical performance benefits of using SUNMIDE 336 in protective coatings?

A: Formulations based on SUNMIDE 336 generally deliver excellent adhesion to metallic and concrete substrates, good chemical resistance, and enhanced flexibility without compromising hardness. Its balanced cure profile supports both ambient and moderate-elevated temperature curing conditions.


Q4: Is SUNMIDE 336 suitable for food-contact or potable water applications?

A: SUNMIDE 336 is not pre-approved for direct food-contact or potable water applications. End-use compliance must be evaluated by the formulator in accordance with applicable regional regulations and intended service conditions — Evonik recommends consulting regulatory experts and conducting appropriate migration and extraction testing where required.



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