Highly flexible aliphatic polyamide structure enabling excellent impact resistance and toughness in cured epoxy systems.
Low viscosity and good compatibility with standard liquid epoxy resins, facilitating easy handling and homogeneous mixing.
Room-temperature curing capability with balanced pot life (typically 4–6 hours at 23 °C) and rapid early strength development.
Superior adhesion to diverse substrates including steel, concrete, aluminum, and composites—even under humid conditions.
Low volatile organic compound (VOC) content and amine-free formulation, supporting safer industrial processing and regulatory compliance.
Industrial floor coatings requiring chemical resistance, abrasion durability, and seamless application.
Marine and offshore protective coatings for ballast tanks, decks, and submerged structures.
Adhesives and structural bonding compounds in wind energy, automotive, and rail manufacturing.
Repair mortars and grouts for civil infrastructure, including bridges, tunnels, and precast concrete elements.
Electrical encapsulation and potting compounds where dielectric stability and thermal shock resistance are critical.
| Chemical Type | Aliphatic polyamide adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber transparent liquid |
| Viscosity (25 °C) | 1,200–1,800 mPa·s |
| Amine Value | 240–270 mg KOH/g |
| Density (20 °C) | 0.94–0.97 g/cm³ |
| Flash Point (PMCC) | ≥120 °C |
| Storage Stability | ≥12 months in original sealed container at <25 °C |
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E-mail: wangxingqiang@ericwchem.com
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