Ultra-fast dynamic surface tension reduction for superior substrate wetting.
Low foaming profile suitable for high-shear and high-speed industrial processes.
Excellent compatibility with anionic, cationic, and nonionic systems without destabilization.
High efficiency at low use levels (typically 0.05–0.3 wt%), enabling cost-effective formulations.
Thermally stable and hydrolytically robust across broad pH ranges (pH 2–12).
Water-based coatings including architectural paints and industrial finishes.
Inkjet inks for wide-format and digital textile printing.
Agrochemical adjuvants to enhance spray coverage and foliar uptake.
Industrial cleaning formulations requiring rapid wetting on low-energy surfaces.
Electronic materials processing, such as photoresist developers and wafer cleaning solutions.
| Chemical Type | Acetylenic diol (nonionic) |
| Product Form | Liquid |
| Appearance | Pale yellow to colorless clear liquid |
| Primary Applications | Wetting agent, leveling aid, defoamer synergist |
| Key Features | Low foam, rapid wetting, broad compatibility |
| Benefits | Improved substrate coverage, reduced defects, enhanced formulation stability |
| pH (1% aqueous solution) | 5.0–7.0 |
| Solubility | Miscible with water and common organic solvents (e.g., alcohols, glycol ethers) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China