Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Evonik VESTOPLAST 888 Amorphous Polyolefin

Evonik VESTOPLAST 888 is an amorphous polyolefin (APO) thermoplastic polymer offering excellent tack, heat resistance, and compatibility with diverse polymers and additives. Designed for hot-melt adhesives, coatings, and compound modification, it enhances melt viscosity control and substrate adhesion without crystallinity-related brittleness. Its low odor, high purity, and consistent performance support demanding industrial applications across packaging, automotive, and hygiene sectors.
  • evonik vestoplast 888 amorphous polyolefin_98da66c7
  • evonik vestoplast 888 amorphous polyolefin_98da66c7

Features Of Evonik VESTOPLAST 888 Amorphous Polyolefin

  1. Excellent thermal stability for high-temperature processing and service applications.

  2. Outstanding adhesion to polar and non-polar substrates including polyolefins, metals, and glass.

  3. Low melt viscosity enabling easy processing via extrusion, hot-melt coating, and adhesive formulation.

  4. High clarity and transparency due to its amorphous molecular structure.

  5. Good chemical resistance against aliphatic hydrocarbons and weak acids.

Typical Applications Of Evonik VESTOPLAST 888 Amorphous Polyolefin

  1. Hot-melt adhesives for packaging lamination and labeling.

  2. Compatibilizer in polyolefin-based polymer blends and recycled material formulations.

  3. Sealant layer in multilayer food packaging films.

  4. Coating binder for metallized paper and flexible barrier laminates.

  5. Carrier resin in masterbatches for functional additives and pigments.

Specifications Of Evonik VESTOPLAST 888 Amorphous Polyolefin

Chemical TypeAmorphous polyolefin (APO)
Product FormPellets
AppearanceTranslucent, off-white granules
Softening Point (Ring & Ball, °C)88–92
Melt Flow Rate (190 °C / 2.16 kg, g/10 min)25–35
Density (g/cm³)0.87–0.89
Primary ApplicationsHot-melt adhesives, compatibilizers, sealants, coatings
Key FeaturesThermal stability, broad substrate adhesion, low melt viscosity, clarity


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