Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Henkel AQUENCE LP3331 Hot Melt Adhesive

Henkel AQUENCE LP3331 Hot Melt Adhesive is a high-performance, fast-setting thermoplastic adhesive designed for automotive interior bonding. It offers excellent heat resistance, low odor, and strong adhesion to plastics, foams, and fabrics. Part of Henkel’s AQUENCE portfolio, LP3331 ensures consistent dispensing, minimal stringing, and VOC-compliant processing—ideal for demanding OEM assembly lines requiring reliability and sustainability.
  • henkel aquence lp3331 hot melt adhesive_c46e1fe7
  • henkel aquence lp3331 hot melt adhesive_c46e1fe7

Features Of Henkel AQUENCE LP3331 Hot Melt Adhesive

  1. High thermal stability for consistent performance in high-speed packaging lines.

  2. Excellent adhesion to low-surface-energy substrates including polypropylene and polyethylene films.

  3. Low odor and VOC-compliant formulation suitable for food-contact-approved packaging applications.

  4. Fast set time enabling rapid line speeds without compromising bond integrity.

  5. Good resistance to moisture, cold, and moderate heat during storage and end-use conditions.

Typical Applications Of Henkel AQUENCE LP3331 Hot Melt Adhesive

  1. Carton sealing for corrugated and solid bleached sulfate (SBS) board packaging.

  2. Label attachment on rigid plastic containers and beverage bottles.

  3. Flexible packaging lamination for snack and confectionery pouches.

  4. Case erecting and tray forming in consumer goods and pharmaceutical secondary packaging.

  5. Bookbinding and graphic arts assembly where clean, non-yellowing bonds are required.

Specifications Of Henkel AQUENCE LP3331 Hot Melt Adhesive

Chemical TypeEthylene-vinyl acetate (EVA) based hot melt adhesive
Product FormPellets
AppearanceOff-white to light amber, uniform cylindrical pellets
Softening Point (Ring & Ball)85–90 °C
Melt Viscosity (at 160 °C)2,500–3,500 cP
Open Time8–12 seconds
Primary ApplicationsHigh-speed carton sealing, flexible packaging, label bonding
Key FeaturesLow odor, fast setting, excellent substrate versatility


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