Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Henkel AQUENCE XP210 Hot Melt Adhesive

Henkel AQUENCE XP210 is a high-performance hot melt adhesive in the AQUENCE series, engineered for demanding industrial bonding—especially automotive interior trim. It offers rapid set time, excellent heat resistance, and strong adhesion to low-surface-energy substrates like PP, TPO, and foams. Solvent-free, REACH-compliant, and designed for high-speed automated application.
  • henkel aquence xp210 hot melt adhesive_fa247de3
  • henkel aquence xp210 hot melt adhesive_fa247de3

Features Of Henkel AQUENCE XP210 Hot Melt Adhesive

  1. Fast-setting formulation enabling high-speed packaging line operation.

  2. Excellent heat resistance up to 70 °C for stable performance in warm environments.

  3. Low odor and low VOC emissions, supporting indoor air quality and occupational safety.

  4. Strong initial tack and excellent bond strength on porous substrates including corrugated board and paperboard.

  5. Compatible with standard hot melt application equipment (e.g., piston, gear pump, and slot-coating systems).

Typical Applications Of Henkel AQUENCE XP210 Hot Melt Adhesive

  1. Case and carton sealing in food and beverage packaging.

  2. Label attachment for rigid plastic and coated paper containers.

  3. Box assembly in e-commerce and retail fulfillment centers.

  4. Bookbinding and graphic arts laminating applications.

  5. Medical device packaging requiring clean, residue-free bonding.

Specifications Of Henkel AQUENCE XP210 Hot Melt Adhesive

Chemical TypeEthylene-vinyl acetate (EVA) based hot melt adhesive
Product FormPellets (standard size: 3–5 mm diameter)
AppearanceOff-white to light yellow translucent pellets
Softening Point (Ring & Ball)85–90 °C
Melt Viscosity (170 °C, Brookfield RV)2,500–3,500 cP
Open Time8–12 seconds at 170 °C
Primary ApplicationsCarton sealing, labeling, bookbinding, medical packaging
Key FeaturesFast setting, low odor, high tack, substrate versatility


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