Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Henkel TECHNOMELT 214LV Hot Melt Adhesive

Henkel TECHNOMELT 214LV is a low-viscosity, thermoplastic polyamide-based hot melt adhesive designed for high-speed automated bonding of porous substrates like paper, cardboard, and textiles. It offers excellent open time, rapid setting, strong adhesion at elevated temperatures, and consistent melt stability—ideal for packaging, labeling, and bookbinding applications requiring precision and reliability.
  • henkel technomelt 214lv hot melt adhesive_052e874e
  • henkel technomelt 214lv hot melt adhesive_052e874e

Features Of Henkel TECHNOMELT 214LV Hot Melt Adhesive

  1. Low-viscosity formulation enables excellent flow and gap-filling on complex substrates.

  2. Fast-setting with short open time (≤ 8 seconds) for high-speed automated assembly.

  3. Excellent thermal stability up to 160 °C during processing and service life.

  4. Good adhesion to low-energy plastics including PP, PE, and PET without primer.

  5. REACH-compliant and halogen-free — suitable for electronics and regulated consumer goods.

Typical Applications Of Henkel TECHNOMELT 214LV Hot Melt Adhesive

  1. Automotive interior trim bonding (e.g., speaker grilles, bezels, air vent components).

  2. Consumer electronics assembly (e.g., housing lamination, sensor mounting, display frame bonding).

  3. White goods and appliance panel attachment (e.g., control panels, decorative overlays).

  4. Medical device component assembly requiring clean, solvent-free bonding.

  5. Flexible packaging lamination where heat resistance and clarity are critical.

Specifications Of Henkel TECHNOMELT 214LV Hot Melt Adhesive

Chemical TypePolyolefin-based thermoplastic hot melt
Product FormPellets
AppearanceOpaque off-white pellets
Softening Point (Ring & Ball)85–90 °C
Melt Viscosity (at 120 °C)~3,500 mPa·s
Application Temperature Range115–135 °C
Primary ApplicationsPlastic-to-plastic and plastic-to-metal bonding in precision assemblies
Key FeaturesLow viscosity, fast set, primer-free adhesion, thermal stability


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