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High-performance polyamide-based formulation for exceptional heat resistance and thermal stability.
Excellent adhesion to low-surface-energy substrates including polypropylene, polyethylene, and PET films.
Optimized open time and set speed for high-speed industrial bonding applications.
Low odor and low volatile organic compound (VOC) emissions, supporting safer workplace environments.
Consistent rheology and thermal stability across extended melt processing cycles.
Flexible packaging lamination — e.g., stand-up pouches and retortable laminates.
Automotive interior trim bonding — including headliners, door panels, and carpet backing.
Hygiene product assembly — such as diaper leg cuffs, ear flaps, and absorbent core bonding.
Bookbinding and graphic arts — for spine gluing and cover attachment on coated and uncoated papers.
Electronics component encapsulation and potting where thermal cycling resistance is required.
| Chemical Type | Polyamide-based thermoplastic hot melt adhesive |
| Product Form | Granules |
| Appearance | Off-white to light tan granules |
| Softening Point (R&B) | Approx. 95–102 °C |
| Melt Viscosity (at 170 °C) | Approx. 4,500–6,500 mPa·s |
| Recommended Application Temperature | 160–180 °C |
| Primary Applications | Flexible packaging, automotive interiors, hygiene products, bookbinding |
| Key Features | Heat resistance, low-odor, excellent substrate versatility, consistent melt stability |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
