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Low-application-temperature formulation enabling bonding of heat-sensitive substrates without thermal damage.
Fast-setting and rapid green strength development for high-speed packaging line integration.
Excellent heat resistance up to 60°C after bonding, maintaining integrity under ambient storage conditions.
Low odor and VOC-compliant formulation suitable for indoor and consumer-facing applications.
High cohesive strength and excellent resistance to creep under sustained load at room temperature.
Case and carton sealing in pharmaceutical and nutraceutical packaging.
Attaching labels and inserts to corrugated and solid board packaging.
Bonding lightweight laminates and coated papers in premium retail packaging.
Assembly of folding cartons for cosmetics and personal care products.
Securing interior components in electronics packaging where low-temperature processing is critical.
| Chemical Type | Polyolefin-based hot melt adhesive |
| Product Form | Granules |
| Appearance | Off-white to light yellow granules |
| Softening Point (Ring & Ball) | 85–90°C |
| Melt Viscosity (at 120°C) | 2,500–3,500 mPa·s |
| Recommended Application Temperature | 105–115°C |
| Open Time | 3–5 seconds |
| Primary Applications | Lightweight packaging assembly, label attachment, carton closing |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
