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Low-application-temperature formulation enabling bonding of heat-sensitive substrates without distortion or discoloration.
Fast setting time with initial tack build-up within seconds, supporting high-speed automated assembly lines.
Excellent thermal stability and consistent melt viscosity across extended dwell times in melter systems.
Non-toxic, solvent-free composition compliant with FDA 21 CFR §175.105 for incidental food contact applications.
Good adhesion to low-surface-energy plastics including polypropylene and polyethylene without priming.
Assembly of medical device packaging, including peelable blister lidding and diagnostic test strip laminates.
Bonding of electronics enclosures and internal components where low-heat exposure is critical for component integrity.
Attaching labels and decorative overlays onto thermally delicate consumer electronics housings.
Bookbinding and luxury packaging for coated paperboard and metallized films requiring clean, cold-bond performance.
Automotive interior trim assembly involving ABS, TPO, and fabric-laminated substrates.
| Chemical Type | Ethylene-vinyl acetate (EVA) copolymer-based hot melt adhesive |
| Product Form | Pellets (standard 3 mm diameter) |
| Appearance | Off-white, semi-crystalline pellets |
| Softening Point (Ring & Ball) | 68–72 °C |
| Melt Viscosity (120 °C, Brookfield RV) | 2,800–3,200 mPa·s |
| Open Time (at 100 °C) | 8–12 seconds |
| Primary Applications | Low-temperature assembly, medical packaging, electronics bonding, premium labeling |
| Key Features | Low-temperature processing, fast set, FDA-compliant, excellent PP/PE adhesion |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
