Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Henkel TECHNOMELT Q3183 Hot Melt Adhesive

Henkel TECHNOMELT Q3183 is a high-performance polyamide-based hot melt adhesive offering exceptional heat resistance, flexibility, and adhesion to challenging substrates like metals and plastics. Designed for demanding industrial bonding—especially in automotive and appliance assembly—it delivers rapid set times, excellent thermal stability up to 120°C, and consistent melt viscosity. Its robust chemical resistance ensures long-term durability in harsh environments.
  • henkel technomelt q3183 hot melt adhesive_40e18f75
  • henkel technomelt q3183 hot melt adhesive_40e18f75

Features Of Henkel TECHNOMELT Q3183 Hot Melt Adhesive

  1. High initial tack for immediate handling strength on porous and non-porous substrates.

  2. Excellent heat resistance up to 80 °C continuous service temperature.

  3. Low odor and low volatile organic compound (VOC) emissions, supporting indoor air quality compliance.

  4. Optimized melt viscosity for consistent bead formation and minimal stringing in high-speed automated dispensing.

  5. Good adhesion to polypropylene, PET, cardboard, and coated papers without primers.

Typical Applications Of Henkel TECHNOMELT Q3183 Hot Melt Adhesive

  1. Case and carton sealing in packaging lines.

  2. Label attachment for beverage and personal care containers.

  3. Assembly of corrugated point-of-purchase displays.

  4. Bonding of flexible packaging laminates requiring FDA-compliant contact surfaces.

  5. Attaching inserts and dividers in retail packaging assemblies.

Specifications Of Henkel TECHNOMELT Q3183 Hot Melt Adhesive

Chemical TypeEthylene-vinyl acetate (EVA) based hot melt adhesive
Product FormPellets
AppearanceOff-white to light yellow, homogeneous pellets
Softening Point (Ring & Ball)85–90 °C
Melt Viscosity (at 180 °C)2,500–3,500 mPa·s
Application Temperature Range160–190 °C
Primary ApplicationsPackaging assembly, labeling, and display construction
ComplianceFDA 21 CFR §175.105 for indirect food contact


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