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Waterborne epoxy dispersion offering low VOC and reduced environmental impact.
Excellent compatibility with amine-based curing agents for ambient or elevated temperature cure.
Good adhesion to metals, concrete, and composite substrates without primer.
Stable shelf life of ≥12 months at 5–30 °C when stored in original unopened containers.
Low viscosity enabling easy handling, mixing, and application via spray, roller, or brush.
Water-based industrial maintenance coatings for steel structures and pipelines.
Eco-friendly protective topcoats for concrete floors in food processing and pharmaceutical facilities.
Base resin in low-VOC two-component epoxy mortars and grouts.
Formulation component for high-performance waterborne epoxy primers and sealers.
Raw material for sustainable composites requiring reduced solvent emissions during processing.
| Chemical Type | Waterborne bisphenol-A epoxy dispersion |
| Product Form | Off-white to light amber liquid |
| Appearance | Homogeneous aqueous dispersion |
| Solids Content (wt%) | 45–48% |
| pH (25 °C) | 7.0–8.5 |
| Viscosity (mPa·s, Brookfield LVT, #3 spindle, 20 rpm, 25 °C) | 150–350 |
| Density (g/cm³, 25 °C) | 1.02–1.06 |
| Primary Applications | Coatings, mortars, primers, and sealers requiring waterborne epoxy performance |
Q1: What is the primary function of HELOXY AQ in waterborne epoxy systems?
A: HELOXY AQ serves as a reactive diluent and viscosity modifier specifically designed for waterborne epoxy resins. It helps reduce formulation viscosity without sacrificing reactivity or final film performance, enabling improved handling, spray application, and coalescence in aqueous dispersions.
Q2: Is HELOXY AQ compatible with standard amine-based curing agents used in waterborne epoxy coatings?
A: Yes, HELOXY AQ is fully compatible with common water-dispersible polyamide and polyamine hardeners. Its glycidyl ether structure retains full epoxy functionality, allowing efficient crosslinking under ambient or elevated cure conditions typical for industrial waterborne epoxy systems.
Q3: How does HELOXY AQ impact the pot life and film formation of waterborne epoxy formulations?
A: As a low-volatility, non-reactive-diluent-type modifier, HELOXY AQ generally extends working time compared to volatile organic diluents while supporting robust film formation. It enhances particle fusion during drying and contributes to improved early water resistance and cohesive strength in the cured film.
Q4: Can HELOXY AQ be used in food-contact or indirect food-contact coating applications?
A: HELOXY AQ is not pre-approved for direct food-contact applications. Formulators intending use in indirect food-contact scenarios must conduct full regulatory evaluation—including migration testing and compliance verification—based on the final cured system and intended exposure conditions.
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
