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Flexible, low-viscosity polyamide solution offering excellent compatibility with standard liquid epoxy resins.
Enables ambient- and low-temperature cure profiles without requiring forced drying or high-heat post-cure.
Delivers superior flexibility and impact resistance in cured epoxy films, reducing brittleness in demanding service environments.
Provides good chemical resistance to alkalis, salts, and mild acids after full cure.
Low odor and reduced amine blush tendency compared to conventional polyamide curing agents.
Industrial maintenance coatings for steel structures, pipelines, and offshore platforms.
Concrete repair mortars and protective flooring systems in warehouses and manufacturing facilities.
Marine antifouling and immersion-grade protective coatings for ballast tanks and hulls.
Electrical encapsulation and potting compounds requiring thermal cycling stability.
Adhesives and structural bonding formulations for metal-to-metal and composite assemblies.
| Chemical Type | Polyamide adduct solution |
| Product Form | Liquid |
| Appearance | Amber to light brown transparent liquid |
| Primary Applications | Ambient-cure epoxy coatings, mortars, adhesives, and encapsulants |
| Key Features | Low viscosity, flexible cure, low amine blush, ambient cure capability |
| Benefits | Improved workability, extended pot life, enhanced toughness, reduced surface defects |
| Typical Amine Value | ~220–250 mg KOH/g |
| Viscosity (25°C) | ~800–1,200 cP |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
