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Low-viscosity liquid formulation enabling excellent mixability with standard epoxy resins.
Room-temperature curing capability with rapid gelation and efficient development of mechanical strength.
Superior chemical resistance, particularly to alkalis and solvents, after full cure.
Low exotherm profile during curing—ideal for thick-section or heat-sensitive substrates.
Halogen-free composition supporting compliance with RoHS and green manufacturing requirements.
Electronics encapsulation and potting for PCBs and power modules.
Structural adhesives in automotive assembly and lightweight composite bonding.
High-performance coatings for industrial flooring and corrosion-resistant linings.
Wind turbine blade bonding and repair systems requiring fast turnaround.
Electrical insulation systems in transformers and high-voltage equipment.
| Chemical Type | Modified amine-based curing agent |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, low-viscosity liquid at 25°C |
| Primary Applications | Room-temperature and elevated-temperature epoxy curing |
| Key Features | Fast reactivity, low volatility, non-crystallizing |
| Benefits | Improved processing safety, extended pot life vs. conventional amines, reduced blush tendency |
| Storage Stability | 12 months unopened at 5–30°C under dry conditions |
| Compatibility | Compatible with standard DGEBA-type and novolac epoxy resins |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
