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Low-viscosity liquid polyamide adduct enabling easy handling and efficient mixing with epoxy resins.
Excellent flexibility and impact resistance in cured epoxy systems, even at low temperatures.
Good chemical resistance to water, alkalis, and mild solvents in fully cured coatings and adhesives.
Extended pot life compared to conventional amine curing agents, supporting longer application windows.
Low volatility and reduced skin sensitization potential, contributing to improved workplace safety.
Industrial maintenance coatings for steel structures and offshore platforms.
Concrete floor coatings requiring toughness, flexibility, and moisture tolerance.
Marine antifouling and protective primers for hulls and ballast tanks.
Adhesives and sealants in transportation and wind energy components.
Electrical encapsulation and potting compounds demanding dimensional stability and dielectric performance.
| Chemical Type | Polyamide adduct (epoxy curing agent) |
| Product Form | Liquid |
| Appearance | Ambient-temperature clear to pale amber viscous liquid |
| Primary Applications | Protective coatings, industrial flooring, marine coatings, adhesives |
| Key Features | Low viscosity, flexible cure, extended pot life, low volatility |
| Benefits | Improved application efficiency, enhanced durability under thermal cycling, reduced health hazard profile |
| Recommended Epoxy Equivalent Ratio | 1.0–1.3 equivalents amine hydrogen per epoxy equivalent (EEW-dependent) |
| Storage Conditions | Store in original sealed container at 15–25°C; protect from moisture and freezing |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
