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Latent at room temperature, enabling extended pot life and improved processing window.
Activates rapidly upon heating, delivering fast gelation and full cure at elevated temperatures.
Provides excellent mechanical properties and thermal stability in cured epoxy systems.
Compatible with standard DGEBA and modified epoxy resins without requiring solvents or co-catalysts.
Low volatility and low odor, supporting safer handling and compliance with industrial hygiene standards.
Aerospace composite prepregs and out-of-autoclave (OOA) manufacturing.
Electrical encapsulation and potting compounds for high-reliability electronics.
Wind turbine blade structural adhesives and infusion resins.
Automotive under-hood components requiring high glass transition temperature (Tg) and dimensional stability.
Industrial tooling matrices and high-performance casting systems.
| Chemical Type | Modified dicyandiamide (DICY)-based latent curing agent |
| Product Form | Free-flowing white to off-white crystalline powder |
| Appearance | White crystalline solid |
| Primary Applications | Epoxy resin systems for composites, adhesives, and encapsulants |
| Key Features | Latency, thermal activation, low dust generation, consistent batch-to-batch performance |
| Benefits | Extended shelf life, reduced risk of premature reaction, enhanced process control |
| Storage Conditions | Store in original sealed container at 15–25°C; protect from moisture |
| Handling Precautions | Use in well-ventilated areas; avoid inhalation of dust and skin contact |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
