High-purity, 100% solid hexamethylenediamine (HMD) derivative offering precise stoichiometric control in epoxy formulations.
Low volatility and negligible vapor pressure ensure safe handling and reduced workplace exposure versus liquid amines.
Excellent reactivity with standard epoxy resins at elevated temperatures, enabling efficient crosslinking and rapid gelation.
Provides superior thermal stability and chemical resistance in cured thermoset networks.
Free-flowing crystalline powder with consistent particle size distribution for reliable metering and dry blending.
Aerospace composite matrices requiring high glass transition temperature (Tg) and low outgassing.
Electrical encapsulation and potting compounds for high-voltage insulation systems.
High-performance adhesives used in structural bonding of metals and composites.
Advanced wind turbine blade resin systems demanding extended pot life and post-cure performance.
Tooling and mold-making materials where dimensional stability and low shrinkage are critical.
| Chemical Type | Aliphatic diamine (hexamethylenediamine-based solid curing agent) |
| Product Form | Free-flowing crystalline powder |
| Appearance | White to off-white granular solid |
| Primary Applications | Epoxy resin curing for high-performance composites and electrical insulation |
| Key Features | 100% active content, low volatility, high thermal stability |
| Recommended Storage | Under inert atmosphere, cool and dry conditions (≤25°C) |
| Handling Precaution | Use appropriate PPE; avoid inhalation of dust and skin contact |
| Regulatory Status | REACH registered; compliant with current EU and US industrial safety guidelines |
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E-mail: wangxingqiang@ericwchem.com
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