English
Español
tiếng việt
русский
Latent at room temperature, enabling extended pot life and ambient storage stability.
Activates rapidly upon thermal triggering (typically >100 °C), delivering efficient epoxy resin cure kinetics.
Produces low-color, high-gloss cured films with excellent chemical resistance and mechanical performance.
Compatible with standard bisphenol-A and bisphenol-F epoxy resins without requiring co-catalysts.
Low volatility and low odor profile, supporting safer handling in industrial environments.
Electrical encapsulation compounds for power modules and LED packaging.
High-performance structural adhesives in aerospace and automotive bonding assemblies.
Powder coatings requiring smooth finish, rapid melt-flow, and controlled crosslink density.
Prepregs and composite matrices where shelf-life stability and precise thermal activation are critical.
Electronics-grade underfills and glob-tops demanding low ionic contamination and high Tg.
| Chemical Type | Dicyandiamide-based latent curing agent |
| Product Form | White to off-white free-flowing crystalline powder |
| Appearance | Crystalline solid, homogeneous granular powder |
| Primary Applications | Epoxy resin systems for encapsulation, adhesives, and powder coatings |
| Key Features | Room-temperature latency, thermal activation onset ~100–110 °C |
| Benefits | Extended processing window, low moisture sensitivity, consistent cure reproducibility |
| Storage Stability | Stable ≥12 months at 25 °C in sealed original packaging |
| Recommended Loading Range | 4–8 phr (parts per hundred resin) depending on epoxy type and performance requirements |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
