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Latent at room temperature, enabling extended pot life and improved processing window.
Activates rapidly upon heating, delivering efficient and consistent epoxy resin cure kinetics.
Low volatility and low odor, supporting safer handling and compliance with industrial hygiene standards.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy resins.
Yields cured systems with high glass transition temperature (Tg) and superior mechanical performance.
Prepregs for aerospace composite laminates requiring precise thermal control.
Structural adhesives in automotive and transportation assembly.
Electrical encapsulation and potting compounds for power electronics.
High-performance coatings for corrosion-resistant industrial equipment.
Wind turbine blade bonding and repair formulations.
| Chemical Type | Dicyandiamide-based latent curing agent |
| Product Form | Free-flowing white to off-white crystalline powder |
| Appearance | White to pale yellow crystalline solid |
| Primary Applications | Epoxy resin systems for composites, adhesives, and encapsulants |
| Key Features | Latency at ambient temperature; thermal activation onset ~130 °C |
| Benefits | Extended shelf life, low dust generation, reproducible cure profile |
| Storage Conditions | Store in original sealed container at 15–25 °C, protect from moisture |
| Handling Precautions | Use in well-ventilated areas; avoid inhalation of dust and skin contact |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
