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Low-viscosity liquid formulation enabling easy handling and homogeneous mixing with epoxy resins.
Room-temperature curing capability with excellent through-cure performance for thick-section applications.
Improved flexibility and impact resistance in cured epoxy systems without compromising thermal stability.
Reduced exotherm compared to conventional amine hardeners, enhancing safety during large-scale casting or potting.
Good compatibility with standard bisphenol-A and bisphenol-F epoxy resins.
Electrical encapsulation and potting of transformers, sensors, and power electronics.
Structural adhesive formulations for aerospace and transportation composites.
High-performance flooring and grouting systems requiring chemical resistance and durability.
Casting of industrial components such as insulators, bushings, and tooling masters.
Wind turbine blade bonding and repair adhesives.
| Chemical Type | Modified aliphatic amine |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Primary Applications | Epoxy resin curing agent for structural adhesives, potting, and casting |
| Key Features | Room-temperature cure, low exotherm, flexible cured network |
| Benefits | Enhanced toughness, improved moisture resistance, reduced shrinkage |
| Storage Stability | 12 months at 20–25°C in unopened original container |
| Reactivity Profile | Moderate reactivity; compatible with accelerators for faster cure if required |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
