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Low-viscosity liquid polyamide offering excellent compatibility with standard epoxy resins.
Provides balanced pot life and rapid ambient-cure performance for efficient production cycles.
Delivers superior flexibility and impact resistance in cured epoxy systems.
Formulated with low volatile organic compound (VOC) content to support sustainable manufacturing practices.
Exhibits good adhesion to metals, concrete, and composite substrates without primer requirement.
Industrial maintenance coatings for steel structures and offshore platforms.
High-performance flooring systems in pharmaceutical and food processing facilities.
Epoxy-based grouts and mortars for infrastructure repair and anchoring applications.
Composite bonding adhesives in wind energy blade assembly and transportation components.
Electrical encapsulation and insulating varnishes requiring thermal stability and dielectric integrity.
| Chemical Type | Polyamide adduct |
| Product Form | Liquid |
| Appearance | Ambient-clear, light amber liquid |
| Primary Applications | Epoxy resin curing agent for coatings, adhesives, and composites |
| Key Features | Ambient-curing, low viscosity, flexible cured film |
| Benefits | Improved workability, reduced mixing energy, enhanced toughness |
| Storage Stability | 12 months at 20–25 °C in original unopened container |
| VOC Content | <100 g/L (as supplied) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
