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High thermal stability with continuous service temperature up to 180 °C.
Excellent electrical insulation properties, ideal for high-voltage encapsulation.
Low viscosity (350–450 mPa·s at 25 °C) enabling superior flow and void-free impregnation.
Fast-curing system compatible with standard epoxy hardeners for efficient production cycles.
UL 94 V-0 rated flame retardancy without halogen additives.
Encapsulation of power electronics, including IGBT modules and EV inverters.
Insulation and potting of high-frequency transformers and inductors.
Structural bonding in aerospace composite assemblies requiring thermal resilience.
Dielectric coating for PCB edge connectors and high-density interconnect substrates.
Underfill material for advanced semiconductor packaging with CTE matching capability.
| Chemical Type | Bisphenol-F based epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Amber to pale yellow transparent liquid |
| Epoxide Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25 °C) | 350–450 mPa·s |
| Density (25 °C) | 1.16–1.18 g/cm³ |
| Halogen Content | Non-halogenated (<0.1 wt% Cl/Br) |
| Storage Stability | 12 months at <25 °C in sealed container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
