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Low-viscosity liquid formulation for easy handling and homogeneous mixing with epoxy resins.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy systems.
Enables rapid room-temperature cure while maintaining extended pot life under controlled conditions.
Delivers high glass transition temperature (Tg) and superior chemical resistance in final cured networks.
Low odor and reduced volatility, supporting improved workplace safety and regulatory compliance.
Electrical insulation encapsulants for transformers, reactors, and busbar systems.
High-performance composite matrices in wind turbine blade manufacturing.
Structural adhesives for aerospace and automotive bonding applications.
Protective coatings for industrial flooring and corrosion-resistant linings.
Potting compounds for power electronics and LED module encapsulation.
| Chemical Type | Aliphatic amine adduct |
| Product Form | Liquid |
| Appearance | Clear to pale yellow, transparent liquid |
| Specific Gravity (25°C) | 0.96–0.99 g/cm³ |
| Viscosity (25°C) | 350–550 mPa·s |
| Amine Value | 240–270 mg KOH/g |
| Reactivity Profile | Room-temperature curable with moderate exotherm |
| Storage Stability | 12 months unopened at 5–25°C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
