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Low-viscosity liquid formulation for easy handling and homogeneous mixing with epoxy resins.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy systems.
Enables rapid room-temperature cure while maintaining extended pot life under controlled conditions.
Delivers high glass transition temperature (Tg) and superior chemical resistance in final cured networks.
Low odor and reduced volatility, supporting improved workplace safety and regulatory compliance.
Electrical insulation encapsulants for transformers, reactors, and busbar systems.
High-performance composite matrices in wind turbine blade manufacturing.
Structural adhesives for aerospace and automotive bonding applications.
Protective coatings for industrial flooring and corrosion-resistant linings.
Potting compounds for power electronics and LED module encapsulation.
| Chemical Type | Aliphatic amine adduct |
| Product Form | Liquid |
| Appearance | Clear to pale yellow, transparent liquid |
| Specific Gravity (25°C) | 0.96–0.99 g/cm³ |
| Viscosity (25°C) | 350–550 mPa·s |
| Amine Value | 240–270 mg KOH/g |
| Reactivity Profile | Room-temperature curable with moderate exotherm |
| Storage Stability | 12 months unopened at 5–25°C |
Q1: What is the primary function of Hiblock BI-180 in coating and adhesive formulations?
A: Hiblock BI-180 is a specialty curing agent designed to enhance crosslinking density and improve final film properties—such as chemical resistance, hardness, and thermal stability—in epoxy, polyurethane, and hybrid resin systems.
Q2: Is Hiblock BI-180 compatible with waterborne systems?
A: Yes, Hiblock BI-180 demonstrates good compatibility with selected waterborne epoxy dispersions and polyurethane dispersions, though formulation optimization—including pH adjustment and co-solvent selection—is recommended to ensure stable dispersion and efficient cure kinetics.
Q3: How does Hiblock BI-180 affect pot life and cure speed compared to conventional amine-based hardeners?
A: Hiblock BI-180 offers a balanced reactivity profile—providing extended working time at ambient temperatures while enabling accelerated cure under mild thermal activation (e.g., 60–80 °C), making it suitable for both ambient-cure and forced-dry industrial applications.
Q4: Can Hiblock BI-180 be used in food-contact or pharmaceutical packaging coatings?
A: While Hiblock BI-180 is formulated with high-purity raw materials and low volatility, its suitability for regulated end uses requires full formulation-level compliance testing and validation by the end-user against applicable regional regulatory frameworks.
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E-mail: wangxingqiang@ericwchem.com
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