Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO KD-213H Epoxy Resin

KUKDO KD-213H Epoxy Resin is a high-performance liquid bisphenol-A epoxy resin from KUKDO’s KD series, offering excellent adhesion, chemical resistance and mechanical strength. Widely used in composites, coatings and electrical encapsulation, it ensures low viscosity, good reactivity with amines/anhydrides and superior thermal stability for demanding industrial applications.
  • kukdo kd 213h epoxy resin_42cc59c7
  • kukdo kd 213h epoxy resin_42cc59c7

Features Of KUKDO KD-213H Epoxy Resin

  1. High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.

  2. Excellent adhesion to metals, composites, and treated plastics under demanding environmental conditions.

  3. Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and void-free casting.

  4. Superior electrical insulation properties with high dielectric strength and volume resistivity.

  5. Good thermal stability with glass transition temperature (Tg) of approx. 125–135°C after full cure.

Typical Applications Of KUKDO KD-213H Epoxy Resin

  1. Electrical encapsulation of transformers, reactors, and high-voltage insulators.

  2. Structural bonding in aerospace composite assemblies and wind turbine blade root joints.

  3. High-performance potting compounds for automotive sensors and power electronics modules.

  4. Matrix resin for filament-wound pressure vessels and carbon fiber reinforced structural components.

  5. Underfill and glob-top materials for semiconductor packaging requiring low stress and high reliability.

Specifications Of KUKDO KD-213H Epoxy Resin

Chemical TypeBisphenol-A based liquid epoxy resin
Product FormClear to pale yellow viscous liquid
AppearanceHomogeneous, transparent, free from gels or sediment
Epoxy Equivalent Weight (EEW)188–194 g/eq
Viscosity (25°C)12,000–15,000 cP
Chloride Content≤ 800 ppm
Volatiles Content≤ 0.3 wt%
Storage Stability12 months at ≤ 25°C in sealed original container


KUKDO KD-213H Epoxy Resin – Frequently Asked Questions (FAQ)

Q1: What is the primary application of KD-213H in epoxy systems?

A: KD-213H is a liquid bisphenol-A based epoxy resin designed primarily as a reactive diluent and viscosity modifier in high-performance coating, adhesive, and composite formulations. It helps improve workability and film formation without significantly compromising crosslink density or chemical resistance.


Q2: How does KD-213H compare to conventional epoxy resins in terms of reactivity and cure profile?

A: KD-213H exhibits moderate reactivity—higher than standard DGEBA resins due to its lower molecular weight and reduced steric hindrance, but lower than highly reactive novolac or glycidylamine types. It typically cures effectively with common amine or anhydride hardeners under ambient or elevated temperature conditions, supporting flexible formulation tuning.


Q3: Is KD-213H suitable for use in food-contact or potable water applications?

A: KD-213H is not pre-certified for direct food-contact or potable water applications. Its suitability depends on full system validation—including final cured formulation, processing conditions, and compliance testing per applicable regional regulations. Customers must conduct thorough end-use evaluation and obtain necessary regulatory approvals before deployment in such sensitive applications.


Q4: What are the recommended storage conditions for KD-213H?

A: Store KD-213H in tightly sealed original containers at temperatures between 10 °C and 30 °C, away from moisture, direct sunlight, and strong oxidizing agents. Prolonged exposure to low temperatures may cause crystallization, which is reversible upon gentle warming to 40–50 °C with thorough mixing. Avoid repeated freeze-thaw cycles.



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