High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics under demanding environmental conditions.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and void-free casting.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good thermal stability with glass transition temperature (Tg) of approx. 125–135°C after full cure.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural bonding in aerospace composite assemblies and wind turbine blade root joints.
High-performance potting compounds for automotive sensors and power electronics modules.
Matrix resin for filament-wound pressure vessels and carbon fiber reinforced structural components.
Underfill and glob-top materials for semiconductor packaging requiring low stress and high reliability.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 188–194 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤ 800 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | 12 months at ≤ 25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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