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High-purity bisphenol-F-based epoxy resin with low chloride content.
Excellent thermal stability and glass transition temperature (Tg) retention after curing.
Low viscosity enables easy processing and improved filler/wetting compatibility.
Superior chemical resistance to alkalis, solvents, and mild acids in cured form.
Consistent reactivity profile suitable for both ambient and elevated temperature curing systems.
High-performance composite matrices for aerospace and wind turbine blade manufacturing.
Electrical encapsulation and potting compounds for power electronics and transformers.
Structural adhesives requiring elevated temperature resistance and dimensional stability.
Coating systems for industrial flooring and corrosion-resistant tank linings.
Prepreg formulations demanding low volatile content and high resin homogeneity.
| Chemical Type | Bisphenol-F epoxy resin |
| Product Form | Liquid |
| Appearance | Pale yellow to colorless transparent liquid |
| Epoxy Equivalent Weight (EEW) | 165–175 g/eq |
| Viscosity at 25°C | 12,000–16,000 mPa·s |
| Chlorine Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | ≥ 12 months at 20–25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
