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High-purity bisphenol-A based liquid epoxy resin with low ionic impurities for enhanced electrical insulation performance.
Optimized viscosity (12,000–14,000 cP at 25°C) enabling excellent processability in casting, potting, and impregnation applications.
Superior thermal stability with glass transition temperature (Tg) up to 175°C after full curing with standard amine hardeners.
Low chlorine content (< 900 ppm), supporting compliance with stringent electronics and aerospace material specifications.
Consistent molecular weight distribution ensuring reproducible reactivity and cured mechanical properties.
High-voltage electrical insulation systems for transformers, bushings, and switchgear.
Encapsulation and potting of power electronics modules including IGBTs and EV inverters.
Structural adhesive formulations requiring high thermal and chemical resistance.
Prepreg and laminates for printed circuit board (PCB) substrates in demanding environments.
Wind turbine blade bonding adhesives and composite matrix resins.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, pale yellow liquid |
| Appearance | Transparent, homogeneous liquid without sediment or haze |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chlorine Content | ≤ 900 ppm |
| Volatiles (150°C, 2 hrs) | ≤ 0.3 wt% |
| Softening Point | Not applicable (liquid at room temperature) |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
