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High-performance reactive acrylic formulation enabling strong, durable adhesion to low-surface-energy substrates.
Excellent resistance to heat, humidity, and thermal cycling — suitable for demanding automotive and electronics environments.
Fast room-temperature cure kinetics without requiring external heat activation, supporting high-throughput manufacturing.
Low volatile organic compound (VOC) content, compliant with stringent industrial health and safety regulations.
Optimized rheology for precise dispensing and controlled bond line thickness in automated assembly processes.
Die attach and component bonding in power electronics modules.
Attachment of sensors and actuators in automotive ADAS systems.
Structural bonding of ceramic and metal substrates in hybrid packaging assemblies.
Edge bonding and underfill reinforcement in LED and display module manufacturing.
Permanent bonding of thermally stressed components in industrial control units.
| Chemical Type | Reactive acrylic polymer system |
| Product Form | Paste, thixotropic |
| Appearance | Off-white to light gray homogeneous paste |
| Primary Applications | Structural die attach, sensor mounting, hybrid packaging |
| Key Features | Room-temperature cure, low outgassing, high Tg (>120 °C) |
| Benefits | Process efficiency, reliability under thermal stress, RoHS-compliant |
| Storage Conditions | 2–8 °C; protect from freezing and moisture |
| Shelf Life | 6 months at recommended storage temperature |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
