Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

LG Chem BN641 Thermoplastic Acrylic Resin

LGChemBN641isahigh-performancethermoplasticacrylicresinfromLGChem’sBNseries,offeringexcellentclarity,UVresistance,andprocessabilityforextrusionandinjectionmolding.Itprovidesoutstandinggloss,weatherability,anddimensionalstability,makingitidealforautomotivetrim,signage,andopticalapplications.Compatiblewithrecyclingandfreeofhalogens,itmeetsstringentindustrialandsustainabilityrequirements.
  • lg chem bn641 thermoplastic acrylic resin_3e9a5e81
  • lg chem bn641 thermoplastic acrylic resin_3e9a5e81

Features Of LG Chem BN641 Thermoplastic Acrylic Resin

  1. Excellent transparency and UV stability for long-term outdoor performance.

  2. High melt flow index enabling efficient extrusion and injection molding processing.

  3. Good impact resistance combined with inherent rigidity and dimensional stability.

  4. Low moisture absorption ensuring consistent mechanical properties in humid environments.

  5. Compatible with common plasticizers and polymer blends for formulation flexibility.

Typical Applications Of LG Chem BN641 Thermoplastic Acrylic Resin

  1. Automotive interior trim components including instrument panels and decorative bezels.

  2. Consumer electronics housings requiring high-gloss, scratch-resistant surfaces.

  3. Medical device enclosures where optical clarity and biocompatibility-supporting processing are essential.

  4. Architectural glazing sheets and light-diffusing panels for LED lighting systems.

  5. Signage and display materials demanding weatherability and color retention.

Specifications Of LG Chem BN641 Thermoplastic Acrylic Resin

Chemical TypePoly(methyl methacrylate) – thermoplastic acrylic resin
Product FormPellets
AppearanceTransparent, free-flowing granules
Melt Flow Index (230°C / 3.8 kg)8–12 g/10 min
Density (23°C)1.17–1.20 g/cm³
Transmittance (at 550 nm, 3 mm)≥92%
Notched Izod Impact Strength (23°C)15–20 kJ/m²
Primary ApplicationsExtrusion, injection molding, and thermoforming


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