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High-reactivity aromatic amine-based curing agent designed for rapid room-temperature or low-temperature epoxy curing.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy resins, enabling homogeneous mixing without phase separation.
Delivers superior mechanical strength, chemical resistance, and thermal stability in cured epoxy systems.
Low viscosity (approx. 1,200–1,800 mPa·s at 25°C) facilitates easy handling, metering, and impregnation in industrial processing.
Reduced volatility and improved handling safety compared to conventional aliphatic amines, supporting safer workplace operations.
Structural adhesives for automotive and aerospace bonding assemblies.
Electrical encapsulants and potting compounds for power electronics and transformers.
High-performance coatings for corrosion protection of steel infrastructure and marine equipment.
Composite matrix resins in fiber-reinforced polymer (FRP) pultrusion and filament winding processes.
Repair mortars and anchoring systems requiring fast strength development under ambient conditions.
| Chemical Type | Aromatic amine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber transparent liquid |
| Primary Applications | Epoxy resin curing agent for adhesives, coatings, composites, and encapsulants |
| Key Features | Room-temperature curable, low viscosity, high reactivity, good chemical resistance |
| Benefits | Shorter cycle times, improved productivity, enhanced durability, reduced energy consumption |
| Storage Stability | ≥12 months at 5–30°C in unopened original packaging |
| Recommended Mix Ratio (by weight) | 100 parts epoxy resin : 25–35 parts L-75T (varies by resin type; confirm via DSC testing) |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
