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Phosphorus-based reactive flame retardant offering excellent thermal stability and low volatility.
Halogen-free formulation compliant with RoHS, REACH, and UL 94 V-0 standards for enhanced environmental and regulatory safety.
High phosphorus content (≥18.5 wt%) enabling efficient char formation and gas-phase flame inhibition.
Good compatibility with epoxy resins, particularly in high-performance printed circuit board (PCB) laminates.
Minimal impact on glass transition temperature (Tg) and mechanical properties of cured resin systems.
FR-4 and high-Tg epoxy-based printed circuit board (PCB) laminates.
Advanced packaging substrates requiring halogen-free compliance and high reliability.
LED encapsulation materials and electronic encapsulants demanding low smoke and low toxicity.
Electric vehicle (EV) battery module housings and insulation components.
Industrial control and 5G communication infrastructure boards operating under stringent flammability requirements.
| Chemical Type | Reactive organophosphorus compound (Resorcinol bis(diphenyl phosphate)) |
| Product Form | White to off-white crystalline powder |
| Appearance | Free-flowing granular solid |
| Phosphorus Content | ≥18.5 wt% |
| Melting Point | 85–95 °C |
| Decomposition Onset Temperature (TGA, N₂) | ≥280 °C |
| Solubility | Freely soluble in common epoxy diluents; compatible with DGEBA-type resins |
| Halogen Content | Non-detectable (<5 ppm by GC-MS) |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
