High purity bisphenol A-based epoxy resin with consistent epoxide equivalent weight (EEW) for reliable reactivity.
Excellent thermal stability and glass transition temperature (Tg) after curing, supporting demanding service environments.
Low viscosity at elevated temperatures, enabling efficient processing in casting, impregnation, and coating applications.
Superior adhesion to metals, composites, and cured polymer substrates without requiring specialized primers.
Compatible with a broad range of amine, anhydride, and phenolic hardeners for formulation flexibility.
Electrical insulation systems for medium- and high-voltage transformers and reactors.
Structural adhesives in aerospace and automotive composite bonding.
Protective coatings for offshore oil & gas infrastructure and chemical processing equipment.
Encapsulants and potting compounds for power electronics and LED modules.
Matrix resin in fiber-reinforced laminates for wind turbine blades and industrial tooling.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gel particles or sediment |
| Epoxide Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–16,000 mPa·s |
| Chlorine Content (Total) | ≤ 1,200 ppm |
| Softening Point | 12–16°C |
| Color (Gardner) | ≤ 3 |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China