High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatile organic compound (VOC) content.
Optimized viscosity for efficient processing in coating, adhesive, and composite applications.
Superior chemical resistance to alkalis, dilute acids, and solvents after curing.
Compatible with standard amine, anhydride, and phenolic hardeners for flexible formulation design.
High-performance protective coatings for industrial steel structures and marine environments.
Electrical encapsulation and potting compounds for transformers and power electronics.
Structural adhesives in automotive and aerospace composite bonding.
Matrix resin for fiber-reinforced plastics (FRP) used in wind turbine blades and piping.
Printed circuit board (PCB) laminates requiring high glass transition temperature and dimensional stability.
| Chemical Type | Bisphenol A diglycidyl ether epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of suspended particles or gel |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 10,000–14,000 mPa·s |
| Softening Point | Not applicable (liquid at room temperature) |
| Chloride Content | ≤ 500 ppm |
| Color (Gardner Scale) | ≤ 3 |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China