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High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low ionic chloride content (<0.05%) for enhanced electrical insulation performance.
Optimized viscosity (12,000–14,000 cP at 25°C) for improved processability in casting, impregnation, and laminating applications.
Superior adhesion to metals, glass fibers, and carbon substrates without requiring surface priming.
Low volatile organic compound (VOC) emission, compliant with REACH and RoHS directives.
Electrical encapsulation and potting compounds for transformers, reactors, and high-voltage insulators.
Structural composites in wind turbine blades and aerospace interior panels.
High-performance printed circuit board (PCB) laminates and prepregs.
Adhesives for automotive electronics and battery module bonding.
Protective coatings for corrosion-resistant industrial flooring and marine equipment.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of gel particles or sediment |
| Epoxy Equivalent Weight (EEW) | 188–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 mPa·s |
| Chloride Content | ≤ 0.05 wt% |
| Softening Point | 12–15°C |
| Storage Stability | ≥ 12 months at <25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
