Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Sanwa KINGMIDE-300 Epoxy Curing Agent

Sanwa KINGMIDE-300 is a high-performance epoxy curing agent from Sanwa’s KINGMIDE series, designed for rapid room-temperature curing with excellent chemical resistance, adhesion, and thermal stability. Ideal for coatings, adhesives, and composites requiring low viscosity and extended pot life.
  • sanwa kingmide 300 epoxy curing agent_a6b53d7a
  • sanwa kingmide 300 epoxy curing agent_a6b53d7a

Features Of Sanwa KINGMIDE-300 Epoxy Curing Agent

  1. Low-viscosity liquid formulation for excellent mixing and processing with standard epoxy resins.

  2. Fast-reacting amine-based chemistry enabling reduced cure times at ambient or mild elevated temperatures.

  3. Provides high crosslink density, resulting in superior chemical resistance and mechanical strength in cured systems.

  4. Low volatility and low odor profile—designed for improved workplace safety and compliance with industrial hygiene standards.

  5. Good compatibility with bisphenol-A and bisphenol-F epoxy resins, supporting broad formulation flexibility.

Typical Applications Of Sanwa KINGMIDE-300 Epoxy Curing Agent

  1. High-performance industrial floor coatings requiring rapid return-to-service and abrasion resistance.

  2. Electrical insulation encapsulants and potting compounds for transformers and power electronics.

  3. Structural adhesives in automotive and rail components where thermal stability and bond durability are critical.

  4. Composite matrix resins for wind turbine blade bonding and repair applications.

  5. Marine-grade protective coatings for offshore platforms and ship hulls exposed to harsh saline environments.

Specifications Of Sanwa KINGMIDE-300 Epoxy Curing Agent

Chemical TypeAliphatic polyamine adduct
Product FormLiquid
AppearanceClear, pale yellow to amber liquid
Primary ApplicationsRoom-temperature and heat-cured epoxy systems
Key FeaturesLow viscosity, fast cure, low exotherm, high Tg capability
BenefitsImproved productivity, enhanced chemical resistance, reduced VOC impact
Density (25°C)Approx. 0.98–1.02 g/cm³
Reactivity ProfileCompatible with standard DGEBA-type epoxy resins at 100:20–30 (resin:curing agent) w/w ratio


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