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Low-viscosity liquid formulation for excellent mixing and processing with standard epoxy resins.
Fast room-temperature cure profile, enabling efficient production without thermal post-curing.
Superior chemical resistance—especially to alkalis, solvents, and mild acids—after full cure.
Low exotherm during curing, reducing internal stress and minimizing warpage in thick-section castings.
Good adhesion to metals, composites, and concrete substrates without mandatory surface priming.
Electrical encapsulation and potting of transformers, sensors, and power modules.
High-performance industrial flooring and protective coatings for factory and warehouse environments.
Structural adhesive formulations for aerospace composite bonding and automotive assembly.
Repair mortars and grouts for civil engineering infrastructure rehabilitation.
Tooling and mold-making compounds requiring dimensional stability and low shrinkage.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Clear, pale yellow to amber liquid |
| Density (25°C) | 0.94–0.97 g/cm³ |
| Viscosity (25°C) | 250–450 mPa·s |
| Amine Value | 380–420 mg KOH/g |
| Reactivity | RT-curable with DGEBA-type epoxies (e.g., EPON 828) |
| Storage Stability | 12 months unopened at 5–25°C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
