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Low-viscosity liquid formulation for excellent mixing and processing with standard epoxy resins.
Fast room-temperature cure profile, enabling efficient production without thermal post-curing.
Superior chemical resistance—especially to alkalis, solvents, and mild acids—after full cure.
Low exotherm during curing, reducing internal stress and minimizing warpage in thick-section castings.
Good adhesion to metals, composites, and concrete substrates without mandatory surface priming.
Electrical encapsulation and potting of transformers, sensors, and power modules.
High-performance industrial flooring and protective coatings for factory and warehouse environments.
Structural adhesive formulations for aerospace composite bonding and automotive assembly.
Repair mortars and grouts for civil engineering infrastructure rehabilitation.
Tooling and mold-making compounds requiring dimensional stability and low shrinkage.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Clear, pale yellow to amber liquid |
| Density (25°C) | 0.94–0.97 g/cm³ |
| Viscosity (25°C) | 250–450 mPa·s |
| Amine Value | 380–420 mg KOH/g |
| Reactivity | RT-curable with DGEBA-type epoxies (e.g., EPON 828) |
| Storage Stability | 12 months unopened at 5–25°C |
Q1: What is the primary chemical class of Sanwa KINGMIDE H-110?
A: Sanwa KINGMIDE H-110 is an amine-based epoxy curing agent, specifically formulated as a modified aliphatic amine adduct designed to balance reactivity, pot life, and final film properties.
Q2: Is H-110 suitable for ambient-cure epoxy systems?
A: Yes — H-110 is engineered for ambient-temperature curing applications, offering practical pot life and reliable crosslinking without forced heating, though elevated temperatures may accelerate full property development.
Q3: How does H-110 compare to traditional DETA or TETA in terms of handling safety?
A: As a modified amine adduct, H-110 exhibits significantly reduced volatility and skin sensitization potential compared to unmodified low-molecular-weight aliphatic amines, improving workplace handling safety and reducing odor intensity.
Q4: Can H-110 be used in high-solids or solvent-free epoxy formulations?
A: Yes — its low viscosity and good compatibility with standard liquid and solid epoxy resins make it well-suited for high-solids, low-VOC, and 100% solids epoxy systems, including industrial coatings and adhesive formulations.
Q5: What guidance is available for optimizing H-110 dosage in a custom formulation?
A: Dosage depends on the specific epoxy resin type, desired cure profile, and end-use requirements; it is typically used at low concentrations relative to resin weight, and fine-tuning is recommended via small-scale trials under representative processing conditions.
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