Enhances wetting and substrate adhesion in aqueous adhesive formulations.
Improves dispersion stability of fillers and pigments in pressure-sensitive adhesives (PSAs).
Reduces surface tension without compromising cohesive strength or thermal stability.
Compatible with acrylic, rubber-based, and styrenic block copolymer adhesive systems.
Non-ionic, low-foaming, and suitable for high-shear processing conditions.
Pressure-sensitive adhesive tapes for industrial and medical use.
Labels and packaging adhesives requiring consistent bond performance on low-energy surfaces.
Hot-melt adhesive emulsions and water-based laminating adhesives.
Automotive interior bonding applications including trim and gasket assembly.
Electronics assembly adhesives where controlled surface energy and residue-free release are critical.
| Chemical Type | Non-ionic surfactant based on modified polyoxyethylene alkyl amide |
| Product Form | Liquid |
| Appearance | Clear to slightly hazy pale yellow liquid |
| pH (1% aqueous solution) | 6.0–7.5 |
| Solubility | Freely soluble in water and common organic solvents (e.g., ethanol, ethyl acetate) |
| Active Content | ≥ 95% |
| Storage Stability | Stable for ≥24 months at 5–30°C in sealed original container |
| Key Features | Low foam, excellent electrolyte tolerance, non-yellowing |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China