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Highly efficient latent curing agent for epoxy resins with extended pot life at room temperature.
Enables rapid, low-temperature curing (120–150 °C) without compromising thermal or mechanical performance.
Excellent compatibility with standard bisphenol-A and novolac epoxy systems.
Low volatility and minimal odor, supporting safer handling and improved workplace hygiene.
Consistent batch-to-batch quality ensured by Shikoku’s stringent GMP-compliant manufacturing control.
Prepregs and filament-wound composites for aerospace and wind energy components.
Electrically insulating encapsulants and potting compounds for power electronics.
High-performance adhesives in automotive structural bonding applications.
UV- and thermally dual-curable coatings for printed circuit board (PCB) protection.
Tooling resins and casting compounds requiring dimensional stability and low exotherm.
| Chemical Type | Imidazole derivative (2-ethyl-4-methylimidazole modified) |
| Product Form | Free-flowing off-white crystalline powder |
| Appearance | White to pale yellow crystalline solid |
| Primary Applications | Epoxy resin curing agent for composites, adhesives, and encapsulants |
| Key Features | Latent, low-odor, low-volatility, high reactivity upon heating |
| Storage Stability | ≥12 months at ≤25 °C in sealed original packaging |
| Solubility | Freely soluble in common epoxy diluents (e.g., DGEBA, glycidyl ethers) and alcohols |
| Recommended Usage Level | 2–6 phr (parts per hundred resin), depending on epoxy type and performance requirements |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
