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Low-temperature latent curing activity with onset around 80–90°C, enabling excellent processing safety and extended pot life.
High reactivity with epoxy resins, delivering rapid gelation and full cure at elevated temperatures (130–160°C).
Excellent thermal stability and low volatility, minimizing weight loss and outgassing during high-temperature processing.
Superior compatibility with standard bisphenol-A and novolac epoxy systems without phase separation.
Non-corrosive to metals and compatible with common accelerators for tailored cure profiles.
Prepregs for aerospace and high-performance composites requiring precise cure control and low residual stress.
Encapsulants and underfills in semiconductor packaging demanding low ionic impurity and high glass transition temperature (Tg).
Adhesives for structural bonding in automotive and electronics where fast throughput and high thermal reliability are critical.
Electrically insulating coatings and potting compounds for power electronics and EV battery modules.
High-temperature resistant laminates used in printed circuit board (PCB) substrates and advanced packaging.
| Chemical Type | 2-Ethyl-4-methylimidazole (2E4MZ), purified derivative |
| Product Form | Pale yellow to light amber crystalline solid |
| Appearance | Free-flowing granules or fine powder |
| Melting Point | 41–45°C |
| Assay (Purity) | ≥ 99.0% (GC) |
| Moisture Content | ≤ 0.5% (Karl Fischer) |
| Primary Applications | Epoxy resin curing agent for high-performance composites and electronics |
| Key Features | Latent, low-odor, non-hygroscopic, low metal ion content |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
