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Low-temperature latent curing activity with onset around 80–90 °C, enabling precise process control.
Excellent storage stability in epoxy resin systems at room temperature for up to 6 months.
High reactivity with aromatic and aliphatic amines, enhancing crosslink density and thermal resistance.
Low volatility and minimal odor, supporting safer handling and improved workplace compliance.
Compatible with standard DGEBA and novolac-type epoxy resins without phase separation.
Prepregs and laminates for high-performance printed circuit boards (PCBs).
Structural adhesives in aerospace and automotive composite bonding.
Encapsulants and potting compounds for power electronics and LED modules.
Carbon fiber reinforced polymer (CFRP) matrix resins requiring low-heat cure cycles.
Electrically insulating coatings for high-voltage equipment and busbars.
| Chemical Type | 2-Ethyl-4-methylimidazole (2E4MZ) |
| Product Form | Pale yellow to light amber liquid |
| Appearance | Clear, homogeneous liquid |
| Primary Applications | Epoxy resin curing agent for high-Tg composites and electronics |
| Key Features | Latent, low-temperature activated, amine synergist-compatible |
| Benefits | Extended pot life, high glass transition temperature (Tg), reduced post-cure energy demand |
| Storage Conditions | Store under nitrogen at 5–25 °C, protected from moisture and direct sunlight |
| Shelf Life | 12 months unopened under recommended conditions |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
