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High-purity imidazole-type latent curing agent specifically designed for epoxy resin systems.
Excellent storage stability at room temperature with extended pot life under ambient conditions.
Activates rapidly at elevated temperatures (typically 120–150 °C), enabling precise thermal control of cure kinetics.
Delivers superior thermal and mechanical performance in cured composites, including high glass transition temperature (Tg).
Low volatility and minimal odor, supporting safer handling and compliance with industrial hygiene standards.
Prepregs and B-staged laminates for aerospace and high-performance printed circuit boards (PCBs).
Structural adhesives requiring controlled cure onset and high bond strength at elevated service temperatures.
Encapsulants and potting compounds for power electronics and electric vehicle (EV) components.
Carbon fiber reinforced polymer (CFRP) matrix resins in automotive and wind energy applications.
Electrically insulating coatings and dielectric films for semiconductor packaging substrates.
| Chemical Type | Imidazole derivative (2-phenyl-4-methylimidazole) |
| Product Form | White to off-white crystalline powder |
| Appearance | Free-flowing crystalline solid |
| Molecular Weight | 158.2 g/mol |
| Melting Point | 116–119 °C |
| Assay (Purity) | ≥ 99.0% (by HPLC) |
| Moisture Content | ≤ 0.5% (by Karl Fischer titration) |
| Primary Function | Latent thermal curing agent for epoxy resins |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
