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High reactivity with epoxy resins at moderate temperatures (80–120 °C), enabling efficient curing without excessive energy input.
Excellent latency at room temperature, providing extended pot life for processing and handling flexibility.
Delivers superior thermal stability and glass transition temperature (Tg) in cured epoxy systems.
Low volatility and minimal odor, supporting safer industrial handling and improved workplace compliance.
Consistent batch-to-batch purity and performance, backed by stringent quality control per ISO 9001 standards.
Aerospace composite prepregs requiring precise cure kinetics and high Tg retention.
Electronics encapsulants and underfill materials where low ionic impurity and dielectric integrity are critical.
High-performance adhesives for structural bonding in automotive and rail transportation.
Wind turbine blade matrix resins demanding reliable latency and post-cure dimensional stability.
3D printing (SLA/DLP) photopolymer formulations requiring thermal-triggered secondary cure enhancement.
| Chemical Type | 2-Phenyl-4-methylimidazole (2P4MZ) |
| Product Form | White to off-white crystalline powder |
| Appearance | Free-flowing fine crystals |
| Molecular Weight | 158.2 g/mol |
| Melting Point | 110–114 °C |
| Assay (by HPLC) | ≥99.0% |
| Moisture Content | ≤0.5% (by Karl Fischer) |
| Key Features | Latent epoxy curing agent with accelerated reactivity above 80 °C |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
