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Latent curing agent with excellent storage stability at room temperature.
Enables low-temperature curing (120–150°C) of epoxy resins without premature reaction.
Delivers high glass transition temperature (Tg) and superior mechanical properties in cured composites.
Low volatility and low odor, supporting safer handling and improved workplace environment.
Compatible with standard DGEBA and multifunctional epoxy systems for broad formulation flexibility.
Aerospace composite prepregs requiring precise cure control and high thermal performance.
Electronics encapsulants and underfill materials demanding low shrinkage and fine-pitch reliability.
High-performance wind turbine blade adhesives and structural bonding compounds.
Automotive electric vehicle (EV) battery module potting and thermal interface materials.
Advanced carbon fiber reinforced polymer (CFRP) tooling and mold-making resins.
| Chemical Type | Imidazole derivative (2-phenyl-4-methylimidazole adduct) |
| Product Form | White to off-white crystalline powder |
| Appearance | Free-flowing granular solid |
| Primary Applications | Epoxy resin curing for composites, electronics, and structural adhesives |
| Key Features | Latent, low-temperature curing, high Tg, low volatility |
| Recommended Storage | Below 25°C, dry and dark conditions; shelf life ≥12 months |
| Compatibility | DGEBA, tetrafunctional epoxies, and cycloaliphatic epoxy resins |
| Handling Precaution | Use in well-ventilated areas; avoid inhalation of dust |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
