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Highly efficient latent curing agent for epoxy resins with extended pot life at room temperature.
Enables rapid thermal curing at elevated temperatures (typically 120–160 °C), improving production throughput.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy systems.
Low volatility and minimal odor, supporting safer handling in industrial environments.
Delivers superior mechanical properties and thermal stability in cured composites.
Electronics encapsulation and underfill materials for semiconductor packaging.
Prepregs and laminates in high-performance printed circuit board (PCB) manufacturing.
Structural adhesives for aerospace and automotive composite bonding.
Carbon fiber reinforced polymer (CFRP) matrix resins requiring precise cure control.
Electrical insulation coatings and potting compounds for power electronics.
| Chemical Type | Imidazole derivative (2-phenyl-4-methylimidazole modified) |
| Product Form | Off-white to light tan crystalline powder |
| Appearance | Free-flowing fine crystalline solid |
| Primary Applications | Epoxy resin curing for electronics, composites, and adhesives |
| Key Features | Latent, thermally activated, low volatility, high reactivity post-activation |
| Recommended Storage | Under dry conditions at 5–25 °C, protected from moisture and direct sunlight |
| Shelf Life | 24 months from date of manufacture when stored properly |
| Handling Precautions | Use in well-ventilated areas; avoid inhalation of dust and skin contact |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
