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Low-temperature latent reactivity: Enables stable storage and precise thermal activation at 120–150 °C.
High purity imidazole derivative: Minimizes volatile by-products and enhances cured resin consistency.
Excellent compatibility with epoxy resins: Ensures homogeneous dispersion without phase separation.
Improved pot life control: Delays gelation at ambient temperature while maintaining rapid cure onset upon heating.
Halogen-free formulation: Supports compliance with RoHS, REACH, and modern green electronics manufacturing standards.
Encapsulants and underfills for semiconductor packaging (e.g., CSP, BGA).
Prepregs and laminates in high-performance printed circuit boards (PCBs).
Structural adhesives for aerospace composite bonding requiring low outgassing.
Electrically insulating coatings for power electronics and EV battery modules.
Thermosetting molding compounds for miniaturized electronic components.
| Chemical Type | Latent imidazole-based curing agent |
| Product Form | Pale yellow crystalline powder |
| Appearance | Free-flowing, non-hygroscopic crystals |
| Primary Applications | Epoxy resin systems for electronics encapsulation and advanced composites |
| Key Features | Latent, thermally activated, halogen-free, high thermal stability |
| Recommended Storage | Below 25 °C, dry, sealed container; shelf life ≥12 months |
| Decomposition Onset Temperature | ≥180 °C (by TGA, N₂ atmosphere) |
| Compatibility | Compatible with DGEBA, novolac, and multifunctional epoxy resins |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
