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High thermal stability enabling extended pot life and controlled cure kinetics at elevated temperatures.
Low volatility and minimal odor, supporting safer handling and improved workplace air quality.
Excellent compatibility with epoxy resins, including solid and liquid bisphenol-A and novolac systems.
Enables high glass transition temperature (Tg) in cured networks without requiring post-cure cycles.
Halogen-free formulation compliant with RoHS and REACH regulatory requirements.
Aerospace composite pre-pregs and out-of-autoclave (OOA) laminates.
High-performance printed circuit board (PCB) laminates and encapsulants.
Electric vehicle (EV) battery module adhesives and structural potting compounds.
Wind turbine blade bonding adhesives and structural composites.
Electronics encapsulation for power modules and IGBTs requiring thermal reliability.
| Chemical Type | Imidazole derivative (2-ethyl-4-methylimidazole modified) |
| Product Form | Pale yellow to light amber crystalline solid |
| Appearance | Free-flowing granules or fine powder |
| Melting Point | 68–72 °C |
| Active Imidazole Content | ≥ 98.5 wt% |
| Moisture Content | ≤ 0.3 wt% |
| Storage Stability (25 °C, sealed) | ≥ 12 months |
| Key Function | Latent epoxy curing agent for heat-triggered crosslinking |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
