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Low-temperature latent curing activity for enhanced processing flexibility.
Excellent thermal stability with delayed onset of reactivity below 100°C.
High compatibility with epoxy resins, including DGEBA and novolac systems.
Minimal volatility and low odor—suitable for enclosed manufacturing environments.
Enables high glass transition temperature (Tg) and mechanical strength in cured composites.
Aerospace-grade structural adhesives requiring precise cure control.
Electronics encapsulants and underfill materials for fine-pitch packaging.
Prepregs and filament-wound composites for wind energy and transportation.
High-performance coatings for corrosion-resistant industrial equipment.
3D printing resins where latency and sharp gelation profile are critical.
| Chemical Type | Imidazole derivative (2-ethyl-4-methylimidazole analog) |
| Product Form | Pale yellow to light amber crystalline powder |
| Appearance | Free-flowing granular solid |
| Primary Applications | Epoxy resin curing agent for composites, adhesives, and encapsulants |
| Key Features | Latent, thermally activated, low volatility |
| Recommended Storage | Under dry, cool conditions (≤25°C), sealed container |
| Solubility | Freely soluble in common epoxy diluents (e.g., phenyl glycidyl ether, propylene glycol diglycidyl ether) |
| Shelf Life | 24 months from date of manufacture when stored properly |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
