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Low-temperature latent reactivity enabling precise processing control in epoxy systems.
High thermal stability with delayed onset of cure, supporting extended pot life and shelf stability.
Excellent compatibility with standard bisphenol-A and novolac epoxy resins.
Produces cured networks with superior mechanical strength and chemical resistance.
Halogen-free formulation meeting stringent environmental and regulatory requirements (e.g., RoHS, REACH).
Prepregs and laminates for high-performance printed circuit boards (PCBs).
Structural adhesives in aerospace and automotive composite bonding.
Encapsulants and underfills for semiconductor packaging.
Electrical insulation coatings and potting compounds for power electronics.
3D printing resins requiring controlled, heat-activated epoxy curing.
| Chemical Type | Imidazole derivative (2-ethyl-4-methylimidazole analog) |
| Product Form | Pale yellow to light amber crystalline solid |
| Appearance | Free-flowing granules or fine powder |
| Melting Point | 65–72 °C (determined by DSC) |
| Active Imidazole Content | ≥ 98.0 wt% |
| Moisture Content | ≤ 0.5 wt% |
| pH (1% aqueous dispersion) | 7.0–8.5 |
| Storage Conditions | Store at 5–25 °C in sealed containers, protected from humidity and direct sunlight |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
